Chemical etching solution formula and process conditions

Etching different metals requires different solution formulations and process conditions. For the etching solution formulations and process conditions of commonly used metal materials, see Table 6-4 to Table 6-6.

Table 6-4 Formula and process conditions of metal chemical etching solution

Solution composition and process conditions 1 2 3 4 5

Ferric chloride (FeCl3)/(g/L)

Hydrochloric acid (HCl)/(g/L)

Hydrofluoric acid (HF)/(mL/L)

Phosphoric acid (H3P04)/(g/L)

Copper sulfate (CuS04)/(g/L)

Sulfuric acid (HzS04)/(g/L)

Nitric acid (HN03)/(g/L)

Etching accelerator/(g/L)

Kerosene/(g/L)

Solution temperature/℃

Processing time/min

Applicable materials 800~900

100~120mL/L

80~120

5~8(Leveling agent)

20~50

15~25

Steel 450~560

5~10mL/L

A small amount

20~50

Die steel 600~800

80~120

20~30

80~100

10~45

15~20

Stainless steel 600~650

90~100

8~12

15~50

10~15

Copper alloy 450~550

200~300

10~20

20~40

10~20

Cast aluminum

Table 6-5 Metal copper chemical etching solution formula and process conditions

Solution composition and process conditions 1 2 3 4

Nitric acid (HN03)/(mL/L)

Sulfuric acid (HzS04)/(mL/L)

Chromic anhydride (Cr03)/(g/L)

Sodium chloride (NaCl)/(g/L)

Solution temperature/℃

Etching time/min 1000

20

45

20~30

15~20 1000

40~50

60~80

10~15 —

50

400

20~30

15~20 50

900~1000

10~20

60~80

10~15

Table 6-6 Chemical etching solution formula and process conditions for zinc castings

Solution composition and process conditions 1 2 3

Nitric acid (HN03, 65%)/(mL/L)

Hydrochloric acid (HCl, 37%)/(9/L)

Solution temperature/C

Processing time 800~1000

20~30

According to the etching depth

210~240

20~30

According to the etching depth

150~300

25~50

According to the etching depth